NOIDA, India, Mar 27, 2025—In a groundbreaking move that underscores its technological prowess, HCLTech has officially joined Samsung’s Advanced Foundry Ecosystem (SAFE™) as a Design Solution Partner (DSP). This strategic collaboration is poised to accelerate next-generation semiconductor design, strengthening HCLTech’s footprint in the global chip industry and reinforcing its reputation as a leader in custom silicon solutions.
The partnership will enable semiconductor manufacturers and technology firms to leverage HCLTech’s cutting-edge ASIC design expertise while utilizing Samsung’s state-of-the-art fabrication processes. As the demand for high-performance, energy-efficient chips surges across sectors like AI, IoT, automotive, and 5G, this collaboration is set to redefine industry standards.
Strategic Impact of HCLTech and Samsung’s Partnership
HCLTech’s inclusion in the SAFE™-DSP program marks a significant step toward advancing semiconductor technology. Through this alliance, HCLTech will provide comprehensive ASIC design services, ensuring that customers can seamlessly integrate Samsung’s 5nm, 4nm, and upcoming 3nm process technologies into their next-generation chip designs.
As part of this initiative, Samsung will offer specialized training, technical support, and enhanced access to Multi-Project Wafer (MPW) programs, enabling cost-efficient prototyping and optimized production timelines. This will accelerate the time-to-market for semiconductor innovations, benefiting industries that rely on high-speed, power-efficient silicon solutions.
Key Advantages of the HCLTech-Samsung Alliance
1. Advanced ASIC and SoC Design Capabilities
With expertise spanning RTL design, physical implementation, functional verification, and silicon validation, HCLTech ensures seamless chip development from concept to production. Customers can expect highly optimized, scalable, and cost-effective semiconductor solutions.
2. Cutting-Edge Semiconductor Process Technologies
HCLTech’s clients will gain access to Samsung’s most advanced semiconductor nodes, including 5nm, 4nm, and the upcoming 3nm Gate-All-Around (GAA) technology, ensuring higher performance, lower power consumption, and reduced silicon footprint.
3. Faster Prototyping with Samsung’s Multi-Project Wafer (MPW) Program
Samsung’s MPW program allows semiconductor firms to efficiently test and validate their chip designs before full-scale production, minimizing risks and accelerating market readiness.
4. Specialized Training & Technical Support
Samsung will provide HCLTech engineers with in-depth training on advanced semiconductor processes, chip packaging, and silicon verification, ensuring that customers receive the highest level of technical expertise.
5. Accelerating Time-to-Market for Semiconductor Breakthroughs
By leveraging the strengths of both HCLTech’s design capabilities and Samsung Foundry’s manufacturing expertise, companies can expect reduced development cycles, faster tape-outs, and superior performance optimization.
Industry Leaders Weigh in on the Partnership
Taejoong Song, Vice President and Head of the Technology Planning 2 Team at Samsung Electronics, emphasized the strategic importance of this collaboration:
“HCLTech’s expertise in SoC platforms, IP partnerships, and advanced silicon design will play a pivotal role in accelerating semiconductor innovation. Together, we are committed to pushing the boundaries of next-generation chip technology and reducing time-to-market for cutting-edge silicon solutions.”
Sanjay Gupta, Corporate Vice President of North Asia at HCLTech, highlighted the impact of this partnership:
“The semiconductor industry is undergoing a major transformation, and our collaboration with Samsung Foundry reaffirms our dedication to developing custom, high-performance silicon solutions. By integrating HCLTech’s ASIC expertise with Samsung’s world-class foundry services, we are set to drive the next wave of semiconductor advancements.”
HCLTech: Strengthening Its Position in the Semiconductor Ecosystem
HCLTech continues to expand its semiconductor engineering and R&D services, investing in cutting-edge technologies such as AI-driven chip design, low-power architectures, and high-speed connectivity solutions. The company’s end-to-end semiconductor design capabilities make it a preferred partner for automotive, industrial automation, networking, and consumer electronics firms worldwide.
By joining the Samsung SAFE™-DSP program, HCLTech solidifies its status as a premier semiconductor design partner, equipped to deliver scalable, next-generation silicon solutions that meet the evolving demands of the digital era.
